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Green High-Density Computing Servers

Industry advanced 2U 12-bay server

Ｎeogenint QuietS-2U12

2U standard rack server

Dual Socket 4th Generation Intel Xeon Scalable Processors

Each CPU supports 8 channels of 16 memory slots, 32 memory slots, and up to 8TB of DDR5 4800MT/s memory

13 x PCIE x 16, supports full-size 12-block GPu/smart acceleration

Supports two 2.5-inch U.2 NVME hard disk bays

1 x IPMI; 1 x VGA; 1 x RJ45; 2xusb 3.0;1xserial port

2 x 2280 M.2 NVME SSD

4 x 80+ 96% Titanium Efficiency 3500W redundant power supply;AC:3500W: 90-260Vac/50-60Hz fanless gallium nitride power supply

L x W x H: 959 x 44.6 x 88mm

Others

4U、6U、8U

8GPU、10GPU

High power consumption high speed fans, air conditioners, water-cooled CDU

Full size, half height/width

QuietS-2U12

12GP

Low power consumption,low RPM silent component fan

Full-size support

4 x 80+96% titanium efficiency 3500W redundant power supply

Advantages:

Standard 42U cabinets can hold more computing power (↑ 50%), reducing infrastructure costs and increasing single cabinet profitability

Increased stand-alone computing power and reduced cost overhead for host platforms

QuietS noise level ≤ 60dB compared to air-cooled 120-100dB

Compatible with all PCI versions of computing cards

PGN1-3500 Self-developed high-efficiency, low-heat, fanless gallium nitride power supply

Green computing infrastructure(GCI)

Supercomputing servers do not require air-cooled or water-cooled, only 15% of air-cooled air-conditioning systems are required

Neogenint RK01

Green Development and Low Energy Computing Build Green Computing Power

Heat flow density

Average Heat-flow Density

50~100W/c㎡

Localized Heat-flow Density

300W/c㎡microstructure enhancement

Chip-level

300-450W flexible and expandable

Cooling capacity

Server-level

4.5-5.0KW flexible and expandable

Cabinet-level

25-30KW flexible and expandable

Distance of
heat
transfer

Unassisted Distance of Heat Transfer

20-25munassisted measures

Micro-assisted Distance of Heat Transfer

25-40mmicrodynamic assistance

Power
usage
efficiency
（PUE）

Server-level

1.03-1.08 without condensing end

1.03-1.13including condensing end

Performance Comparison

Type

Air-cooled

Liquid-cooled/Cold Plate/Spraying

RK01

Note

PUE

Maintain

Life-cycle

Cost

Eco-friendly

1.5-2.0

easy maintenance and repair

5-10 years

air-conditioning, internal cooling, fans, multiple heat transfer power

refrigerant, heat exhaust, noise

1.1-1.3

fluid replacement, leakage, clogging powderizing

2-3 years

water circulation system corrosion replacement, lower power heat dissipation

corrosiveness

≤1.1

maintenance-free

10 years

45% reduction in operating expenses; 30% savings over liquid-cooled inputs; 1/10th of the maintenance cost of liquid cooling

Self-developed environmentally friendly working substance formula

RK01 is calculated for the case of no green power participation at all

RK01 is compatible with third-party servers and SXM GPU

Noise level ≤ 60dB

Dual Socket 63A Intelligent PDU

Unified O&M with compute loads, energy energy systems, O&M systems, operations systems, and cooling system.

Heterogeneous Cloud Computing Systems

Heterogeneous equipment unified management

Relying on cloud-native technology, it supports heterogeneous computing of different computing units of CPU, GPU, ASIC, FPGA and multi-regional IDC computing resources management and scheduling.

Cross-cluster Migration

Elastic remote JUPYTER KERNEL supports cross-cluster, cross-IDC, cross-region, cross-scenario unified scheduling and migration operations.

Distributed Model Training

Ultra-large-scale parametric quantitative models support distributed training of models with more than 100 billion parameter sizes.

Multi-User Subsystem Monitoring

Rich user subsystems to perform monitoring, approval, multi-template billing, etc.